Plasma Cleaning

Sauerstoff O₂

Plasma cleaning of organic contaminants

Plasma cleaning involves the removal of organic contaminants by a reactive plasma generated in a chamber. A reactive gas plasma, often called an oxygen or O₂ plasma, is created in the chamber. This plasma actively reacts with the contaminants on the surface of the material.

The UV radiation generated in the plasma breaks the carbon bonds of the organic compounds. The reactive gas then combines with the dissolved impurities. These reaction products are removed from the chamber in a gaseous state, leaving the surface clean, precise and free of residue.

Plasma cleaning is an environmentally friendly and highly accurate method used in a variety of industries, including electronics, medical and research, for the efficient removal of organic residues.

Micro Sandblasting

Plasma cleaning of inorganic contaminants

Plasma cleaning (Micro sandblasting) is ideal for removing inorganic contaminants.

The high UV content of the plasma effectively breaks down carbon deposits.

At the same time, the activated gas molecules are accelerated to high speeds. These molecules act like a micro-sandblast, removing even the smallest contaminants from the product surface.

Once the optimum process conditions have been defined, extremely high levels of surface cleanliness can be achieved.

This process is essential in the electronics industry and other applications where the highest standards of cleanliness are required.