Low-Pressure vs. Atmospheric Plasma
Low-pressure plasma occurs in a controlled vacuum. This ensures zero recontamination and allows the safe use of reactive gases (like Hydrogen) without explosion risks.
Industrial Low-Pressure Plasma Cleaning
Achieve atomic-level surface purity with an eco-friendly, dry process designed to remove contaminants without damaging sensitive substrates.
20 Years of Surface Engineering Expertise
A message from our founder, Jörg Eisenlohr:
"What began as a mission to provide reliable industrial plasma cleaning has evolved into a two-decade legacy of solving complex cleaning challenges, from basic grease removal to the ultra-clean requirements of EUV lithography."
Read more advice below on points to consider when selecting a plasma cleaning process.
1. Oxygen (O₂) Plasma
Removing Organic Contaminants
The Science: UV radiation breaks carbon bonds, while reactive oxygen species convert contaminants into gaseous H2O and CO2, which are evacuated via vacuum.
Best For: Oils, greases, mold release agents, and fingerprints.
O2 plasma cleaning
A short animation showing the oxygen plasma cleaning process.
2. Micro-Sandblasting
Removing Inorganic Contaminants
The Science: Noble gas molecules (Argon) are accelerated to high speeds, physically "knocking" inorganic impurities off the surface through sputtering.
Best For: Salts, oxide layers, and lead traces from sensitive electronics.
Removing Inorganic Contaminants
A short animation showing the micro-sandblasting process.
The Unseen Cleaning Challenges
| Challenge | Non-Conductive Materials | Conductive Materials |
|---|---|---|
| Temperature | Generally not an issue for these substrates. |
Hollow cathode effects can cause localized overheating. Controlled heating may be used to drive off volatiles. |
| Process Gas | Primarily uses Oxygen (O2) to remove organic contamination. | Wide choice of gases depending on the contamination profile and desired surface result. |
| Chamber Loading |
Ensure plasma access to all surfaces to prevent "shadowing." Maintain good spacing to prevent re-contamination. |
Density matters; increased surface area acts as a larger cathode, potentially reducing cleaning intensity. Poor spacing control may induce hollow cathode effects. |
Process - Monitoring and confirmation
Surface Energy Analysis
Contact Angle Measurement:
This is the primary method for post-process confirmation. A drop of liquid is placed on the surface; a low contact angle indicates high surface energy and a successful cleaning cycle.
Note: High contact angles may still persist on inherently low-energy materials like PTFE, even after successful cleaning.
Thermal Control
IR & Thermal Indicators:
To protect temperature-sensitive substrates, we utilize IR sensors and thermal indicator labels to ensure the plasma does not exceed the material's safety threshold.
Visual Observation:
Hollow cathode effects (visible as intense "glow" areas) can be monitored through the chamber window. If observed, parameters like pressure or power are adjusted in real-time to prevent part damage.
Optical Emission Spectroscopy (OES)
Plasma Color Analysis:
Every gas and contaminant emits a specific light frequency (color) when ionized. By using spectrometry, we can monitor the "cleaning progress" in real-time. When the spectral lines associated with carbon contaminants disappear, the process is automatically confirmed as complete.
Process - Consistency
Requires more than a stored process
We provide support and design for chamber loading systems to:
- prevent process variations due to changing loading density or position
- ensure exposure of the surfaces to be treated
- Minimize danger of recontamination
Double door systems are available to ensure separation of clean and raw material
Frequently Asked Questions
Can all materials be cleaned?
Most metals, glass, ceramics, and plastics are ideal. Materials must be "vacuum-compatible"—high moisture materials or closed-cell foams may require specialized degassing cycles.
Ready to Validate Your Process?
We offer contract cleaning, rental systems, and full process development at our facility in Germany.
Request a Trial Treatment