Primary Objectives

Increasing Surface Area

Micro-roughening surfaces to significantly improve adhesion for bonding or coating.

Removing Oxides

Eliminate native oxides on silicon or metal surfaces to prepare substrates for perfect subsequent processing.

Cleaning Inorganic Contamination

Ensure a pristine surface by removing residues and particles for high-precision applications.

Pattern Transfer

Transfer high-resolution masks to underlying materials for micro- and nanoscale structures.

Process Demonstration

Plasma Etching

Watch reactive ions remove surface material at a controlled rate to increase surface area.

Why Choose Plasma Etching?

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Dry Processing

Zero wet chemicals. No risk of liquid contamination.

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Eco-Friendly

Reduced hazardous waste compared to wet etching.

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High Precision

Sub-micron accuracy for delicate structures.

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Extreme Clean

No mechanical residues or fluid particles.

Innovation: Zero-Emission Etching

PCB Fabrication & Desmearing

Traditional etching uses perfluorinated hydrocarbon gases that are costly and environmentally taxing. Our proprietary technology changes the game by significantly improving the environmental friendliness of the plasma etching processes and thus ensure the long-term viability of plasma etching.

Fluorine Recirculation

Our system generates its own gases and recovers them for reuse. This eliminates environmental emissions and slashes operational costs.

View Recovery Technology

Diagram showing the circular recovery process of fluorinated gases in plasma etching — Closed-loop Fluorine Recovery System

High-Precision Plasma Etching Solutions