Plasma Etching

The four primary objectives of plasma etching are:

• Removing Oxides:

  Plasma etching is commonly used to remove unwanted oxide layers, such as native oxides on silicon or metal surfaces, to prepare the substrate for subsequent processing.

• Cleaning Inorganic Contamination:

  It effectively eliminates inorganic contaminants, including residues and particles, ensuring a clean and uniform surface for high-precision applications.

• Pattern Transfer:

  Plasma etching is crucial in transferring patterns from a photoresist or mask to an underlying material during microfabrication, enabling the creation of detailed structures at micro- or nanoscale resolution.

• Increasing surface area:

  Plasma etching roughens the surface at a microscopic level, increasing the available surface area for bonding or painting, thereby improving adhesion.Improving adhesion

These objectives highlight the versatility and critical role of plasma etching in state-of-the-art material processing and manufacturing.

Advantages of plasma Etching

• Dry Processing: Plasma etching is a dry process, eliminating the need for wet chemicals and reducing the risk of contamination or damage to delicate structures.
• Environmental and Safety Benefits: Compared to traditional wet etching, plasma etching uses fewer hazardous chemicals, minimizing waste and environmental impact.
• Compatibility with Various Materials: Plasma etching can be used on a wide range of materials, including metals, oxides, polymers, and semiconductors.
• High Precision: It allows for precise material removal, enabling the creation of micro- and nanoscale features.
• Extremely Clean:No residues from fluids or particles from mechanical surface roughening.

Applications of Plasma Etching

Preparation:

Plasma etching is often a preparatory step to enhance the results of subsequent processes.

It is a versatile and indispensable tool in industries requiring precision, material selectivity, and advanced processing.

Printed Circuit Board (PCB) Fabrication:

Removing oxides or contaminants to improve solder mask adhesion

Etching traces and vias in multilayer PCBs and wafers.

Please see our pager on Zero Perfluorinated Emissions.

Generally, perfluorinated hydrocarbon gases are used to accelerate the etching process.

However, their emissions should be avoided whenever possible.

At Plasma Technology, we have invested significant effort into developing a process that eliminates these emissions while also reducing the cost of acquiring and storing such gases.

Our system generates its own perfluorinated hydrocarbon gases and recovers them for reuse, thereby eliminating emissions into the environment and lowering operational costs. This innovative approach enables plasma etching with fluorine recirculation, making the process both environmentally friendly and cost-effective.