Low pressure plasma processing

low pressure plasma processes can be broken down into 3 main groups

1. Cleaning

The removal of contamination either organic or inorganic from the surface.

2. Etching

A process to actively remove material from the surface of the substrate.

3. Coating

The functionality or the look of the surface is modified to fit customer needs.

Efficiency

The low-pressure plasma processor can be programed to carry out a single or a combination of these plasma processes without the need to handle the product until completed.

An example application of multiple process steps is optimizing bond strength or the adhesion of paints. For more information, please see our page on improved adhesion.

Plasma etching / ashing

During the plasma etching process, the material is removed selectively from the surface of the substrate.

For example, from polymers or elastomers as a step towards improving adhesion.

A more aggressive version of this process is the removal of excess material such as copper to produce circuit boards. This more aggressive process is often referred to as plasma ashing.

Learn about our research to reduce or eliminate perfluorinated hydrocarbon emissions during this process